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TuoLi TL-19A 10in1 BGA Mid-Level Reballing Stencil Platform For iPhone

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Out of stock


TuoLi TL-19A 10in1 BGA Mid-level Motherboard Re balling Stencil Platform for iPhone X – 12 Pro Max

7,500.00

Out of stock

TuoLi TL-19A 10in1 BGA Mid-level Motherboard Re balling Stencil Platform for iPhone X – 12 Pro Max
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Features:

  • Tin-planting Platform
  • For The Mid-level Motherboard
  • Support iPhone X – iPhone 12 Pro max
  • Magnetic Adsorption I Precise Position Double-Sided Position I 10 iN1
  • Magnetic Fitting Design
  • Make the stencil and motherboard fit closely equipped with a magnetic scraper make tin scraping and planting more easily
  • Cylinder Alignment
  • High-precision matching, precise alignment perfect fit CPU Solder joint integrated positioning/de-gluing/planting tin

Package includes:
1 x TuoLi TL-19A Re balling Stencil Platform

Category:
Weight0.15 kg

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