SAMSUNG SAM7 AMAOE Stencil
Amaoe BGA Reballing Stencil For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA IC Solder Tin
Description:
High quality BGA Stencil.
Specially designed for Samsung 9/S9+
Make your repair work easier.
Material: Stainless Steel
Thickness:0.12mm
| Weight | 0.05 kg |
|---|
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