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SAMSUNG SAM7 AMAOE Stencil


Amaoe BGA Reballing Stencil For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA IC Solder Tin

900 1,199

Description:
High quality BGA Stencil.
Specially designed for Samsung 9/S9+
Make your repair work easier.
Material: Stainless Steel
Thickness:0.12mm

Amaoe BGA Reballing Stencil For SAMSUNG S9/S9+ CPU RAM POWER WIFI AUDIO For Snapdragon 845 CPU PM845 Chip BGA IC Solder Tin
SKU: UIVC84 Categories: ,
Weight 0.05 kg

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