Features:

• RL-044 Android series chip planting tin steel stencil set, precise alignment, fast and convenient, high-quality steel, round square holes, high-temperature resistance, no deformation
• Supports Qualcomm Snapdragon/Dimensity/Hisilicon Kirin/Exynos/BGA/Android and other series
• Use mobile phones for actual measurement to ensure accuracy, each mesh is calibrated according to the mobile phone drawings to ensure that every solder joint is indispensable
• It is specially designed and used for mobile phone chips, the round and square precise hole positions make the solder balls more rounded and meet the tin planting requirements for various chips
• Ultra-thin and super tough, ultra-thin design, better fit of tin planting, continuous bending, and full toughness
• High temperature and wear resistance, high-quality special steel is selected, which has good high-temperature resistance and metal fatigue resistance, so that each tin point is heated evenly
• The round and square precise hole position makes the solder balls more rounded and prevents the mesh holes from jamming the solder balls

Package includes:

• 58 x Stencil