Mijing Z21 Max CPU A18 Pro Planting Tin Mesh

Mijing Z21 Max CPU Chip BGA Stencil Platform Set for iPhone A18

Mijing Z21 Max CPU A18 Pro Planting Tin Mesh Best Price in Pakistan Only Available @ Official Web Link

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BGA Reballing Stencil For iPhone 16 Pro Max Mainboard Repair

Features:

• Automatic precise positioning
• The new magnetic dynamic original positioning
• Strong magnetic force automatic clamping

Installation Method:

• Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
• Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)

Package includes:

• 1 x BGA Stencil