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Mijing Z21 Max BGA Stencil Platform Set for Android


Mijing Z21 Max BGA Stencil Platform Set for Android / Hisilicon / Qualcomm Snapdragon

6,500 7,500

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Mijing Z21 Max BGA Stencil Platform Set for Android

Mijing Z21 Max BGA Stencil Platform Set for Android / Hisilicon / Qualcomm Snapdragon

Mijing Z21 Max BGA Stencil Platform Set for Android Best Price in Pakistan Only Available @ Official Web Link

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Features:

  • Automatic precise positioning
  • The new magnetic dynamic original positioning
  • Strong magnetic force automatic clamping

Installation Method:

  • Prepare the tin planting platform and close the chip with a small triangle, fixed on the clamping position (It shall be consistent with the direction of the steel mesh)
  • Place the steel mesh directly on the slot of the magnetic suction base to complete the installation (Check whether the mesh is aligned with the bottom chip)

Package includes:

  • 1 x Tin planting platform set
Weight 0.09 kg

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