Features:

Mechanic AD-223 Soldering Flux Paste Jar 100GM

Play in the welding process: remove oxides and reduce the surface tension of the material to be welded two main effects paste chemicals.

U.S. AM-TECH developed two ways to use the phone PCB, BGA and PGA SMD Rework help paste, which is used in low ionic activator system, run tin speed, low level of smoke residue after curing of the surface insulation resistance value is very high, so very small electrical interference for mobile phones and other communication products.

MECHANIC AD-233 as a leave-in help paste residue color is very light, very high SIR value, recommended for BGA, CSP ball array solder joint repair ball.

Package Includes:

• 1 x Mechanic AD-223 Soldering Flux Paste Jar (100G)