EMMC STENCIL BGA 6 In 1
6-IN-1 BGA Reballing Stencil Template for BGA153/162/169/186/221 EMCP/EMMC, High temperature resistant with ventilation hole, prevent bulges and avoid hump on the BGA Reballing Stencil Template
₨900
6 IN 1 BGA Reballing Stencil Template for EMMC/EMCP BGA221 BGA153 BGA169 BGA254 BGA162 BGA186 Mobile Phone Repair
Product introduction:
6-IN-1 BGA Reballing Stencil Template is high quality iPhone repair tool for fix iphone motherboard BGA chip. It designed with ventilation hole, are provided with holes for ventilation and heat dissipation to prevent any damages. The high temperature resistant and top steel BGA Reballing Stencil Template is avalible for BGA153/162/169/186/221 EMCP/EMMC.
| Weight | 0.05 kg |
|---|
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