Amaoe, BGA Stencils, Qualcomm
Amaoe Mbga-B5 BGA Reballing Stencil Tin Planting
Amaoe Mbga-B5 Middle Layer BGA Reballing Stencil Set for Android CPU SM8250 MSM8916 / 8917 / 8937 / 8939 / 8940 / 8953 / 8998 SDM660 / 439
₨7,000
CompareAmaoe Mbga-B5 BGA Reballing Stencil Tin Planting
Amaoe Mbga-B5 Middle Layer BGA Reballing Stencil Set for Android CPU SM8250 MSM8916 / 8917 / 8937 / 8939 / 8940 / 8953 / 8998 SDM660 / 439
| Weight | 0.35 kg |
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