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AMAOE IP 6S/6SP-A9 STENCIL


AMAOE IP 6S/6SP (A9) STENCILStencil for CPU Reballing for CPU Reballing for tin mesh Wrap Around Microchip BGA Heating MSM8956 CPU Redmi, Steel Stencil

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AMAOE IP 6S/6SP-A9 STENCIL

AMAOE IP 6S/6SP (A9) STENCILStencil for CPU Reballing for CPU Reballing for tin mesh Wrap Around Microchip BGA Heating MSM8956 CPU Redmi, Steel Stencil

AMAOE IP 6S/6SP-A9 STENCIL Best Price in Pakistan Only Available @ Official Web Link

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Description:

  • High quality BGA Stencil.
  • Specially designed for IP 6S/6SP (A9)
  • Make your repair work easier.
  • Material: Stainless Steel
  • Thickness:0.12mm
  • Package includes:

    • 1 x Stencil

AMAOE IP 6S/6SP (A9) STENCILStencil for CPU Reballing for CPU Reballing for tin mesh Wrap Around Microchip BGA Heating MSM8956 CPU Redmi, Steel Stencil

Weight 0.15 kg

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