Amaoe Emmc3 (EMMC/EMCP/UFS/UMCP/LPDDR/NAND/PCIE) Stencil

The Amaoe Emmc3 Stencil is a universal, multi-functional tool suitable for EMMC, EMCP, UFS, UMCP, LPDDR, NAND, and PCIE reballing tasks. This high-quality stencil offers support for a wide range of BGA configurations, including BGA162, BGA153, BGA169, BGA221, BGA178, BGA254, BGA297, and BGA186. Ideal for professionals and technicians, it ensures precise alignment and efficient reballing for mobile phone motherboard chips and other components.

Key Features:

• High Compatibility: Supports various BGA types for versatile usage.
• High Precision: Designed for accuracy and efficiency in reballing tasks.
• Durable Material: Built to withstand repeated use in demanding repair environments.
• Universal Application: Perfect for chip repair across multiple technologies like NAND, LPDDR, and more.

Package Includes:

• 1 x  Stencil

Price:
Best price in Pakistan available only at www.kbgsmstore.com.