2uul PB01 / PB02 PadBall Solder Balls for Android Solder Pad Rework – 100K

2UUL PB02 PadBall Solder Balls Best Price in Pakistan Only Available @ www.kbgsmstore.com

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Features:

• Sn63/Pb37 Alloy: Reliable eutectic composition (183°C melting point) for smooth reflow and strong joints.
• Dual Compatibility: Ideal for both Android device repairs (PB02 Android)
• Precision Sizing: Uniform diameters (0.2mm/0.3mm/0.45mm/0.6mm/0.76mm) for BGA/CSP pad restoration.
• High Purity: Low oxidation with minimal residue, reducing bridging risks.
• Bulk Quantity: 100K balls per bottle (30g net weight) for cost-effective repairs
• Each bottle contains 100,000 precision-sized solder beads (0.2~0.76mm) to meet demanding micro-soldering applications

Specification:

• Material: Sn63/Pb37 (Tin 63%/Lead 37%)
• Size Options: 0.2mm, 0.3mm, 0.45mm, 0.6mm, 0.76mm
• Package: Sealed anti-static bottle (131*105*48mm)
• Net Weight: 7.2g (Android)
• Applications: Restore damaged pads on Android mainboards; Reballing GPU, CPU, or chipset components; Precision PCB repairs under microscope

Packaeg includes:

• 100000 x Solder Balls